| 摘要 |
<p>PURPOSE:To perform adhering and provisional fixing by perfect close contact without leaving air bubbles and thus enable to well perform perfect cutting of the titled wafer by a method wherein the compression bonding of said wafer is performed with a pressing block via a protecting material by using a tape having micro holes, and said tape is vacuum-adsorbed by a vacuum adsorbing table. CONSTITUTION:The tape 14, wafer 2, and protecting material 15 are superposed on the flat upper surface of the vacuum adsorbing table 12. While evacuating the tape 24 on said table 12 by operating a vacuum pump 13, the pressing block 16 is lowered and the wafer 2 is pressed on the table 14 via the protecting material 15. Thereby, the wafer 2 is compression-bonded to the table 14, the air bubbles between both are evacuated between molecules or micro holes of the tape 14, and both closely contact perfectly and are then fixed as it is. When the provisional fixing of the wafer 2 to the tape 14 is completed, the protecting material 15 and the pressing block 16 are removed from the wafer 2 in the state of continued evacuation. Dicing such as perfect cutting is performed by sliding a blade 3 on the wafer 2.</p> |
