发明名称 THERMAL TREATMENT AND EQUIPMENT FOR THE SAME
摘要 PURPOSE:To realize the accurate, uniform and efficient thermal treatment of a treated object by a method wherein the treated object is set afloat in contactless manner and irradiated by an electromagnetic wave such as microwave and heated under such conditions. CONSTITUTION:For instance, a semiconductor wafer 2 is set in a wafer floating jig 3 and an inert gas 4 is supplied from a gas supplying inlet 6. The semiconductor wafer 2 is set afloat, showing natural vertical movement or rotation, by the air current of the inert gas in the wafer floating jig 3. A microwave 8 is radiated by a microwave generator 9 and applied in a treatment chamber 1 through a waveguide 10 and the semiconductor wafer 2 is heated by the microwave 8. The wafer 2 is heated from inside and does not touch the jig 3 or the like. After the temperature reaches the prescribed value, reactive gas 5 necessary for forming a protective film 15 is supplied into the wafer floating jig 3 through the gas supplying inlet 6 and, while the temperature is maintained at a constant value by controlling the intensity of the microwave by a thermosensor 12, the wafer 2 is treated for a prescribed period.
申请公布号 JPS59152618(A) 申请公布日期 1984.08.31
申请号 JP19830026178 申请日期 1983.02.21
申请人 HITACHI SEISAKUSHO KK 发明人 AMADA HARUO
分类号 H01L21/205;C23C16/44;C23C16/458;C30B25/10;C30B25/12;C30B31/12;C30B31/14;H01L21/18;H01L21/22;H05B6/80 主分类号 H01L21/205
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