| 摘要 |
PURPOSE:The titled glass capable of being bonded to copal and alumina in high yield, consisting of glass having a coefficient of linear thermal expansion between those of copal and alumina, softening point of <= a specific temperature, and <= specific value of OH group content. CONSTITUTION:Frit glass having a coefficient of thermal expansion of glass between those of copal and alumina, <=400 deg.C softening point, and <=500ppm OH group content in the glass, being fluidized at low temperature, capable of bonding glass to copal and alumina, useful for bonding containers housing semiconductor. When IC package is sealed using this glass, it can be bonded to copal and alumina at <=400 deg.C low temperature in high yield without causing cracks, packages having high reliability can be prepared, yield of elements housed in them is raised by about 10%.
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