| 摘要 |
A process for ion plating wherein plating material is melted, vaporized, and then subjected to an ionization environment within a vacuum chamber, to create a plasma of ionized atoms by evaporating in the radio frequency field, and the process for plating such ionized material onto a substrate in the absence of any gas, inert or otherwise. It is an ion plating process without the need of an inert gas plasma wherein a high particulate energy is given to ionized particles of a plating material thus composites film build up representing a layer atomically bonded to the substrate carrier material. |
