| 摘要 |
PURPOSE:To produce a space between the backside of a package and the surface of a substrate preventing a crack at solder junction due to thermal shock from happening by a method wherein multiple conductor pads are provided on the backside of a package containing semiconductor elements to solder conductor pins therewith and when the package is placed on a circuit substrate, the conductor pins are soldered with connecting electrodes provided on the substrate. CONSTITUTION:Multiple pads 12 are formed on the backside of a package 1 containing semiconductor elements to solder conductor pins 4 respectively therewith. On the other hand, connecting electrodes 21 corresponding to the conductor pins 4 are provided on the surface of a circuit substrate 2 whereon the package 1 is placed to be soldered with the conductor pins 4. In such a constitution, a space may be produced between the package 1 and the substrate 2 and the conductor pins 4 may play a role of buffer against thermal shock preventing a crack at solder junction from happening. |
