发明名称 FLAT PACKAGE
摘要 <p>PURPOSE:To facilitate positioning and provisional locking work and prevent the displacement from the provisional locking position at the time of permanent locking work by providing mounting guide terminals and then inserting them into holes provided in a mounting substrate. CONSTITUTION:The positioning of lead terminals 12, 12... to conductor patterns 16, 16... on the mounting substrate 14 is performed by inserting the mounting guide terminals 13, 13... into the holes 15, 15 of said substrate 14, and each lower part of said guide terminals 13 and 13 is bent on the side of the back surface of said substrate 14. Since the positions of the mounting substrate 14 and the flat package are fixed 1 to 1, the positioning is easy, and the time required for the work is largely shortened. The molding of said terminals 13 and 13 can be performed in the same process by working the metal mold used in the process of molding lead terminals.</p>
申请公布号 JPS59150457(A) 申请公布日期 1984.08.28
申请号 JP19830013987 申请日期 1983.01.31
申请人 TOSHIBA KK 发明人 KITAGAWA YUKIO;MATSUBA MASAAKI
分类号 H05K1/18;H01L23/50;H05K3/30;H05K3/34 主分类号 H05K1/18
代理机构 代理人
主权项
地址
您可能感兴趣的专利