| 发明名称 |
Solderless connection technique and apparatus |
| 摘要 |
Contact portions of a first array of conductive elements are urged against mating contacts of a second array by a pressure applicator comprising a resilient open celled plastic material to establish and maintain an electrical connection therebetween.
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| 申请公布号 |
US4468074(A) |
申请公布日期 |
1984.08.28 |
| 申请号 |
US19790034001 |
申请日期 |
1979.04.30 |
| 申请人 |
ROGERS CORPORATION |
发明人 |
GORDON, HERMAN B. |
| 分类号 |
G01R31/28;H01R12/04;H01R33/74;H05K3/32;H05K7/10;(IPC1-7):H01R23/72 |
主分类号 |
G01R31/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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