| 摘要 |
PURPOSE:A flame-retarding photopolymer composition excellent in soldering-heat resistance and thermal shock resistance, containing a phosphorus-containing urethane di(meth)acrylate, a linear polymer compound, a sensitizer or sensitizer system, and a halogen atom-containing component. CONSTITUTION:A resin composition containing (A) 20-75pts.wt. phosphorus-containing urethane di(meth)acrylate compound obtained by reacting (i) a diisocyanate compound selected from the group consisting of trimethylhexamethylene diisocyanate, isophorone diisocyanate, and lysine diisocyanate, with (ii) a phosphorus-containing dihydric alcohol of the formula and (iii) a dihydric alcohol (meth)acrylate monoester, (B) 0-30pts.wt. photopolymerizable unsaturated compound other than component A, (C) a linear polymer compound having a glass transition point of about 40-150 deg.C, and (D) a sensitizer or/and sensitizer system which generate free radicals upon irradiation with actinic light, wherein at least one of components (A), (B), and (C) contains covalently bonded halogen atoms. Formula I wherein R and R<1> are each lower alkyl or lower haloalkyl, R<2> and R<3> are each lower alkylene, R<4> is lower alkylene, and R and R<1>, or R<2> and R<3> may be the same or different.
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