| 摘要 |
PURPOSE:To decrease thermal impact and thermal strain and to reduce soldering time by placing a material to be soldered on a soldering part, preheating the neighbohood of the soldering part and irradiating a laser beam to the central solderin part. CONSTITUTION:Soldering parts 3a, 3b of an electronic part 4 are placed on a soldering base plate 1. IR rays 8, 10 or hot air is applied around the soldering parts to preheat the same. A laser beam 7 is then irradiated to a spot position 9 to melt solder 6 and to solder the soldering parts. The thermal impact and thermal stress arising from the quick local heating by the laser irradiation are decreased by the preheating near the soldering part. Since a flux is preliminarily evaporated by the preheating, the scattering of the solder and the flux is obviated and the soldering parts are not contaminated. |
