发明名称 LEAD FRAME
摘要 PURPOSE:To remarkably reduce the rate of generation of bur and thus contrive to simplify the number of manufacturing processes and to improve the yield by a method wherein projections contacting the wall of bur checking piece of a metal mold is provided in the neighborhood of a resin sealed type package of the outer lead. CONSTITUTION:The broken line 15 represents the part coated with mold resin, and the lead frame 41 is punched and formed to the form having the projections 42 in the neighborhood of the outer leads outside the broken line 15. The leads 41b are fitted to grooves 32 between the bur checking piece 31 provided on the metal mold. Since the projections 42 provided on the leads 41b block the grooves 32, the outflow of the mold resin from a cavity 30 can be prevented, and accordingly burs do not generate.
申请公布号 JPS59150458(A) 申请公布日期 1984.08.28
申请号 JP19830016387 申请日期 1983.02.03
申请人 TOSHIBA KK 发明人 SHINDOU MASAMICHI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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