发明名称 EXPANDABLE, BONDABLE COMPOSITION
摘要 PURPOSE:To provide the titled compsn. which can be easily applied to adherends having an uneven surface, can be firmly bonded to the adherends and can form a thick-wall foam layer, by dissolving a fixing agent in an aq. solvent and suspending an expandable resin powder therein. CONSTITUTION:A thermoplastic resin (e.g. ethylene/vinyl acetate copolymer), a blowing agent (e.g. azodicarbonamide) which can be decomposed and expanded at the softening temp. of said resin (in a quantity of pref. 0.5-20wt% based on the quantity of expandable, bondable compsn.), a crosslinking agent (e.g. dicumyl peroxide), etc. are mixed togther to obtain an expandable resin powder. An aq. solvent (e.g. a mixture of 100pts.wt. water and 10-200pts.wt. alcohol), a fixing agent (e.g. starch or cellulose) soluble in said solvent and 20-80wt.% (based on the entire quantity of compsn) expandable resin powder (insoluble in the solvent) are mixed together to obtain an expandable, bondable compsn. in the form of a slurry.
申请公布号 JPS59149965(A) 申请公布日期 1984.08.28
申请号 JP19830024470 申请日期 1983.02.15
申请人 NITTO DENKI KOGYO KK 发明人 ROKUSHIYA TADAHIRO;TOMINAGA TAKASHI;ASOSHINA HIDEYUKI;HORI MASAHIKO
分类号 C09J201/00 主分类号 C09J201/00
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