| 摘要 |
A novel photosensitive composition for dry development in the ultra-fine pattern formation of the semiconductor industry, which is composed of at least one of acrylic and vinyl ketone polymers and a specified subliming bisazide compound as a photocuring agent, is disclosed. The use of the photosensitive composition provides a very effective ultra-fine pattern formation process in the semiconductor industry with such advantages that unexposed areas are selectively removable by treating with a plasma, and consequently plasma development becomes available so that high resolution may easily be obtained. Automating and dry processing of all the stages ranging from development processing to stripping processing become available when using the photosensitive composition of this invention. No expensive treating reagents are needed and environmental pollution is eliminated.
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