| 摘要 |
PURPOSE:To obtain the molding device with which a gate cutting work can be done easily by a method wherein the substantial strength of a gate part is made smaller, and to prevent the damage generating at the package part when the gate is cut off after formation. CONSTITUTION:Immediately after resin 12a has been filled in each acvity 7 through the intermediary of a runner 5 and a gate 6 by having the plunger 10 to press the resin tablet 12 located in a pot 8, before the resin 12 is hardened yet in other words, an armature is operated downward by applying a current to a solenoid, and the lower end of a pin 14 advances to inside of a gate 6. The resin is hardened maintaining the above condition. As a result, on these miconductor device which is picked out from between cavity blocks 3 and 4, a recessed part 22 of the shape corresponding to the lower end of the pin 14 on the upper part of a package part 20 is formed on the resin 21 of the gate part which is formed in one body with the package 20. As a result, when a gate cutting process is performed after molding, the resin 21 of the gate part can be cut off easily at the recessed part 22, thereby enabling to prevent the damage generating on the package part 20. |
