| 摘要 |
PURPOSE:To protect a semiconductor element part from corrosion by a method wherein an adhesive, with which a semiconductor element is adhered, or a protective resin, with which the element is sealed, is cured, and, after that, into either one of the adhesive and the protective resin is mixed an additive, from which an alkaline component is released, and an acid solution, which generates from the adhesive or the protective resin, is neutralized. CONSTITUTION:An epoxy resin of the bisphenol system or the phenolic novolak system has been used for an adhesive 14 and a protective resin body 16 and the adhesive 14 and the protective resin body 16 have been formed using dicyandiamide, etc., as the curing agent. Among the principal ingredients of gas which generates after the adhesive 14 and the protective resin body 16 were cured are a nitrogen compound with amine, amido and nitrile group, which generates from a resin solvent and a reactive diluent; and gasses such as aldehyde, alcohol, water, carbon monoxide, acetone and methane, which are produced by the thermal decomposition of the curing agent. At this time, ammonia and amino group, etc., have been added to the principal agent and the diluent so that ammonia gas is also generated at the same time. Ammonia is madeto create ammonia water due to the infiltration of water content. This ammonia water neutralizes hydrogen chloride which generates from the adhesive or the protective resin and eliminates the corrosiveness. |
