| 摘要 |
PURPOSE:To prevent the damage in an aluminum pad at the time of measurement, by sticking a substrate, which has the same bumps as those on the aluminum pad of an LSI chip and an anisotropic connector, which has conductivity only in the direction of thickness, together. CONSTITUTION:Gold bumps 5 are formed on a silicon wafer 4 at the same pitch as that of an aluminum pad of an LSI. An anisotropic connector 8, which has a conductor pitch that is 1/5 or less the pitch of the aluminum pad and has the conductivity only in the direction of thickness, is stuck on the bumps 5 together. The connector 8 is formed by a silicon rubber sheet 6 and a gold wire 7. Measurement is performed by aligning the aluminum pad of the LSI and the gold bumps 5 and slightly applying pressure. |
