| 摘要 |
A heat-fusible polyimide compound film which comprises a polyimide film and a heat-fusible layer composed of a polyimide precursor having a volatile material content of about 5 to about 50% by weight which is prepared by converting a part of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula <IMAGE> with an aromatic diamine into imide, provided on at least one surface of the polyimide film, and a process for producing the film. |
