| 发明名称 |
Apparatus for slicing semiconductor material |
| 摘要 |
The invention relates to an apparatus for slicing semiconductor material using a saw made of a metal strip. The metal strip is composed of an amorphous and ductile material, for example 78% Ni, 8% Si and 14% B, and has a thickness of 30 to 40 mu m. The sawing waste can be substantially reduced by using such a metal strip (5). <IMAGE>
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| 申请公布号 |
DE3305695(A1) |
申请公布日期 |
1984.08.23 |
| 申请号 |
DE19833305695 |
申请日期 |
1983.02.18 |
| 申请人 |
SIEMENS AG |
发明人 |
REUSCHEL,KONRAD,DR.PHIL.NAT. |
| 分类号 |
H01L21/304;B23D51/04;B23D61/12;B28D1/22;B28D5/00;B28D5/04;C30B33/00;(IPC1-7):B28D5/04;C30B35/00 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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