发明名称 PREPARATION OF THIN FILM OF METAL
摘要 PURPOSE:In carrying out vacuum metallizing on a substrate consisting of a high polymer material, to form a stable thin film at high speed without making the substrate cause heat distortion, thermal decomposition and wrinkle, by applying a potential difference to a specific part, earthing the thin film of metal at a position in the vicinity of winding part of the substrate. CONSTITUTION:In forming a thin film of metal directly or through a thin film of metal on the substrate 6 consisting of a high polymer material running along the outer peripheral face of the cylindrical can 2, a potential difference is applied to a space between the cylindrical can 2 and the thin film of metal, and the thin film of metal is earthed directly or through resistance of metal roll, etc. in the vicinity of the winding part 4 of substrate. EFFECT:Voltage impressed to the substrate 6 at the winding part 4 is lessened by earthing of the thin film of metal, repulsion force between the substrates is lessend, so that wrinkle during winding is prevented.
申请公布号 JPS59147026(A) 申请公布日期 1984.08.23
申请号 JP19830023223 申请日期 1983.02.14
申请人 MATSUSHITA DENKI SANGYO KK 发明人 SUGITA RIYUUJI;UENO FUMIAKI;HONDA KAZUYOSHI
分类号 C23C14/14;C08J7/04;C23C14/56 主分类号 C23C14/14
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