| 摘要 |
PURPOSE:To provide the titled composition having improved moldability and processability without lowering the original characteristics of the base resin, by compounding a specific bisphthalimide to a resin. CONSTITUTION:The objective composition is prepared by compounding (A) 100pts.wt. of a polyether amide resin having the recurring unit of formula I (R1-4 are H, lower alkyl, lower alkoxy, Cl or Br; R5 and R6 are H, methyl, ethyl, trifluoromethyl or trichloromethyl; Ar is p-phenylene, m-phenylene, diphenylene ether, diphenylene sulfone, diphenylene or naphthylene) with (B) 0.5- 20pts.wt., preferably 2-6pts.wt. of a bisphthalimide compound of formula II (X is -O-, -SO2-, -CO- or -CH2-), e.g. phthalic acid N,N'-4,4'-diphenylmethane-bisimide.
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