发明名称 |
MANUFACTURE OF ELECTRONIC COMPONENT |
摘要 |
PURPOSE:To form a required space on an element simply and to decrease the whole size of an electronic component by applying a silicone rubber for absorbing vibration to an end face of the element, covering the whole by a thermal contraction tube and contracting the tube by heating. CONSTITUTION:In pasting a surface elastic wave filter chip 7 to an insulating board 6 and applying electrical connection thereto, the height of the silicone rubber 8 at both ends of a surface elastic wave propagating line is formed higher than the height of the chip 7. Then, the whole is covered with the thermal contraction tube 9 and the tube is contracted by heating, then a space slightly higher than the height of a silicone rubber 8 is formed on the surface elastic wave filter chip 7. The required space is formed on the surface elastic wave filter chip without using a cap by molding it by a resin 9. |
申请公布号 |
JPS59146210(A) |
申请公布日期 |
1984.08.22 |
申请号 |
JP19830020024 |
申请日期 |
1983.02.09 |
申请人 |
MATSUSHITA DENKI SANGYO KK |
发明人 |
MATSUI ATSUSHI;NISHIMURA KENICHI |
分类号 |
H03H9/25;H03H3/08;H03H9/10 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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