| 摘要 |
PURPOSE:To improve the yield rate for assembling work by a method wherein, using one main surface of a soldering material piece for bonding and a semiconductor substrate as a reflecting surface, the attraction and holding condition of a soldering material piece and a semiconductor substrate is judged based on the presence or nonpresence of reflection of the light projected from a light emitting part of a reflection type photocoupling device to a light receiving part, thereby enabling to ensure the excellent bonding condition and to obtain a non-erroneous judgment. CONSTITUTION:The collet 72 with which a soldering material piece for bonding is supported is formed into a bottomed cylindrical body and its tip face, the bottom part in other words, is constructed in such a manner that a small hole 10 connected to a vacuum attraction hole 6 is formed. At the pickup state judgment part, when a pickup device with which a pickup operation was performed is moved to the point located above a reflection type photocoupling device 11, the light generated at the light emitting part of the reflection type photocoupling device 11 is projected. When there is misattraction on the solder material piece 31 for bonding and when the soldering material piece 31 is not present on the tip surface of the collet 72, no photocoupling state can not be formed. The judgment on the attraction and holding condition can be given based on the presence or not of photocoupling condition on the reflection type photocoupling device 11. |
