| 摘要 |
PURPOSE:To enable to perform a high density mounting of parts on a printed board as well as to improve the driving characteristics of a logic circuit by a method wherein a ceramic capacitor is incorporated on the bottom part of the ceramic substrate which constitutes a carrier, and a capacitor and a chip carrier are formed into one body. CONSTITUTION:A laminated ceramic capacitor 17 is formed on the bottom part of a ceramic substrate 6. Said ceramic capacitor 17 is formed in one body with a chip carrier 5 by alternately laminating a thin plate type ceramic layer 19, on the upper plane surface of which an electrode 18 is formed by vapor-depositing an aluminum layer, for example, to one end face. Said laminated electrode 18 is alternately connected to an earth conductive layer 13 and a power source conductive layer 12 using notched parts 9 and 10. A metallization such as Cr, Au and the like is performed on the bottom face of the recessed part of the ceramic substrate 6, and a logic circuit chip 20 is die-bonded. Then, the earth electrode 22 located on the upper surface of a logic circuit chip 20 and an earth pattern 15 exposed on the end face of a recessed part 8 are wire-bonded using a fine wire 22a such as Au and the like. |
