Wire bonding apparatus for semiconductor device

摘要

At least first and second ultrasonic horns are coupled to one capillary in a state wherein a prescribed angle is defined therebetween. In accordance with the angle defined by a straight line connecting a pad on a semiconductor pellet and a corresponding inner lead of a lead frame with respect to a prescribed direction, control is made of the amounts of ultrasonic wave energy to be applied to the first and second ultrasonic horns. The bonding portion is bonded by the capillary in accordance with a composite vector of those vectors corresponding to the energies supplied to the first and second ultrasonic horns.