| 摘要 |
PURPOSE:The titled photosensitive polyamide-imide excellent in heat resistance, electrical properties, and mechanical properties, prepared by polymerizing an aromatic tetracarboxylic acid with a specified aromatic diamine compound having a cinnamamide bond, and imidating the product. CONSTITUTION:An aromatic tetracarboxylic acid (dianhydride), e.g., 3,3',4,4'- biphenyltetracarboxylic acid, is polymerized with an aromatic diamine compound of the formula (e.g., 4,4'-diaminocinnamanilide) at about 100 deg.C or below for about 1-48hr in an organic solvent (e.g., N,N-dimethyl sulfoxide). The produced polyamide-imide precursor solution is diluted with an organic solvent and, after adding an imidating agent (acetic anhydride or pyridine), heated to about 100 deg.C or below for above 0.5-5hr to imidate the precursor into the purpose polyamide- imide.
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