| 摘要 |
PURPOSE:To improve the inspecting efficiency by photographing the surface of a bonding pad and the position on a plane surface which has a ball in height higher by ultrafine size from the surface of the pad in a small depth of focus, suitably processing the photograph signals and inspecting them. CONSTITUTION:A semiconductor pellet 4 is secured on a leadframe 3 to be inspected, and a semiconductor 2 in which inner leads 5 are connected to the bonding pads 6 of the pellet 4 through wirings 7, is placed on an inspecting table 1. The wirings 7 employ Au wires, balls are formed at the ends, pressed on the pads 6 and connected. An X-Y mechanism 9 and a Z-mechanism 10 are provided on the table 1, thereby positioning in plane directions and height direction of the semiconductor device 2. An ITV camera 11 is installed above the table 1. A signal processor 12 which has an image processor 12 and a computer 14 is connected to the camera 11. The signal of the camera 11 is converted into binary number, and the shape and size of an image are recognized, thereby judging the bonding state. |
