| 摘要 |
<p>PURPOSE:To improve a step coverage by coverting and heat treating the prescribed region of a thin tantalum film formed on a substrate with a titanium film, and then removing the titanium film, thereby forming by once metal wirings and a terminal. CONSTITUTION:A titanium film 7 is bonded onto a nitrided tantalum film 4, and the film 7 is patterned to remove the other part except wiring connection unit and external lead terminal connection unit. Then, a nitrided tantalum film 4 is patterned to form a resistor, and the part on the conductor 3 is removed. The nitrided tantalum film of the part of the resistor is converted into an oxide 3', trimmed and then heat treated. Then, the titanium 7 is removed by sulfuric acid etching solution.</p> |
