HYBRID MICROWAVE SUBSYSTEM

摘要

A hybrid micro-wave subsystem includes a high thermally conductive dielectric substrate having wrapped around a thin-film metalized ground plane such that a center area on the top surface is left exposed. Electrode bonding pads are arranged within this center area to receive respective electrodes of a flip-mounted transistor device. A thin-film matching network is mounted onto the center area and is connected to respective ones of the bonding pads. Discrete components are directly mounted onto the top surface for connection with the transistor device.