Method of projection copying masks onto a workpiece

摘要

A description is given of the special form of the alignment marks (8) on a semiconductor layer (6) which is to be photolithographically processed. The alignment marks (8) comprise the actual mark (8), which is dark in the alignment light, and a surrounding area (19) which is adjacent to the mark and bright in the alignment light and in which regions of different optical thickness alternate. <IMAGE>