| 发明名称 |
Device for cooling integrated circuit chips |
| 摘要 |
A package with an integrated circuit is cooled by pressing it toward, and into contact with, a resilient mat which contains a metallic layer for the more uniform distribution of the heat flow. Said mat is in contact with a plate cooled by water.
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| 申请公布号 |
DE3404027(A1) |
申请公布日期 |
1984.08.16 |
| 申请号 |
DE19843404027 |
申请日期 |
1984.02.06 |
| 申请人 |
SPERRY CORP. |
发明人 |
C. MITTAL,FAGUIR;R. SOLIS,CHARLES |
| 分类号 |
H01L23/36;H01L23/367;H01L23/373;H01L23/473;(IPC1-7):01L23/36 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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