| 摘要 |
PURPOSE:To facilitate the confirmation whether or not an element is accurately mounted at a fixed position on a substrate by a method wherein the first and second terminals provided to the titled element of flat package type are provided alternately on both sides of the package, and the first terminal is connected to the wiring on the surface of a printed substrate, and the second terminal to the wiring on the back surface of the substrate via a hole, respectively. CONSTITUTION:When the first and second terminals 33 and 34 are provided to the titled element 31 of flat package type, these are formed on the side surfaces opposed to each other of the element body 32 so that the terminals 33 and 34 become alternate, respectively. At this time, the first terminal 33 is kept Z- shaped, and the second terminal 34 L-shaped. Next, surface printed wirings 36 corresponding to the terminals 33 are formed on the surface of the printed substrate 35 whereon the body 32 is loaded, and back surface printed wirings 37 corresponding to the terminals 34 on the back surface. Thus, the terminals 33 are soldered to the wirings 36 by the reflow of the irradiation with infrared rays, and the terminals 34 are made to abut against the wirings 37 via the holes 38 and then soldered by solder dipping. |
