发明名称 AUTOMATIC SOLDERING DEVICE
摘要 PURPOSE:To stick surely and effectively an adequate amt. of solder and to improve working efficiency by passing metallic caps, which are supplied continuously, through a flux base and a solder melting base in contact therewith. CONSTITUTION:A rod 26 pushes out the metallic cap 4 loaded in a feeder 23. The cap 4 is held in a rotating suction chuck 14 and is moved slightly while the opening edge thereof is placed on a flux base 27. An oscillating member 13 moves the cap 4 in contact therewith over the entire circumference while oscillating slightly vertically so that a flux is coated over the entire part at the outside circumferential opening edge thereof. The cap passes similarly over a solder melting base 30 while rotating in contact therewith and the thin film-like solder is stuck on the cap 4. When the cap 4 comes to near the final end of the base 30, a hollow shaft 17 is pulled to detach the cap 4 from the base 30, then the chuck 14 falls onto a working table T. A sensor detects the fall and feeds compressed air, by which the cap 4 is blown off so as to fall into a cap receiver 34.
申请公布号 JPS59141369(A) 申请公布日期 1984.08.14
申请号 JP19830014537 申请日期 1983.02.02
申请人 KOMA SHOJI:KK 发明人 FUKAZAWA SUSUMU
分类号 B23K1/20;B23K3/00 主分类号 B23K1/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利