| 摘要 |
Disclosed is a wafer handling device for a sputtering system where wafers, used in the manufacture of integrated circuits, are placed in a loading chamber, removed from the loading chamber and conveyed by a conveying device through a transportation chamber where they are individually picked from the conveying device by the wafer handling device and placed on a rotating table within the system sputtering chamber to be sputter processed. Concurrently within the placing of one unprocessed wafer on the rotating table, a processed wafer is picked from the rotating table and placed on a second conveying device or the same conveying device which brought unprocessed wafers to the wafer handling device for return to the loading chamber to be removed from the sputtering system for further handling and processing. While some edge contact of the wafer may sometimes occur when the wafer is off center of the claws of the wafer handling device, it is the bottom surfaces of the processed and unprocessed wafers which are the principal points of contact by the conveying device(s) and wafer handling device to avoid damage of the top surface of the wafer.
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