| 摘要 |
PURPOSE:To mount a semiconductor device sufficiently by capability in the same extent as the mounting of one-surface IC by setting up an electrode for an external output only on one surface of both-surface semiconductor device. CONSTITUTION:A silicon base 1 in both-surface semiconductor device is provided with a semiconductor device 2 as the surface and a semiconductor device 2' as the back. An electrode 3' for an external output from the back semiconductor device 2' is outputted to the surface by forming a through-hole 14 to the base 1, and electrodes 3, 3' for external outputs are concentrated to one surfaces. Accordingly, mounting work for an IC is facilitated while easy design and manufacture are enabled. |
