| 摘要 |
PURPOSE:To obtain an LSI package, cost thereof is low, by extending a plurality of leads and a lead for holding the package up to a section where they must be joined with a sealing body formed previously through a joining member. CONSTITUTION:A plurality of leads 8 are held and fixed between a first package 1 and a second package 3 through glass 9. A lead frame 15 is formed by etching and pressing a sheet made of Kovar, an iron-nickel 42 alloy, etc. The lead 8 extends along the upper surface of the second package 3 on the inside of a package section 10 while it is bent at two positions and its nose section extends along the surface slightly projecting from approximately the same plane as the upper surface of the first package 1 on the outside of the package section 10. The outer end sections of these leads 8 are superposed on the terminal sections of a printed wiring substrate. |
