| 摘要 |
PURPOSE:To enable to eliminate the unsatisfactory contact between wires of the titled device by a method wherein the angle between the adjoining wires is equalized by making intervals of pads on a chip larger as they approach the corner along the side of the chip, thereby enabling to maintain the intervals of the wires to be required. CONSTITUTION:The tip of a lead 3 is arranged on the straight line radially extended in the same angle from the center 0 of the chip in such a manner that pattern density will be made uniform, and the above is formed into L1=A2= L3=L4. Also, on the side of the chip, the chip center 0, a pad 2 and the tip of the lead 3 are alined on a straight line by arranging a bonding pad on the straight line which is radially extended from the chip center with the equal angle, thereby enabling to make the wire inerval d almost same distance. In this case, the above is turned to l1>l2>...>l4, and the pad interval can be made larger as going nearer to the circumference of the chip. A sufficient interval of wires can be obtained at the corner part of the chip, too, thereby enabling to prevent the contact between the wires. |
