| 摘要 |
<p>A heat-generating power semiconductor chip is mounted in a package to permit testing or use of the chip before or after mounting of the package to a heat spreader plate. A plurality of sheet metal leads are attached to a dielectric substrate, such as beryllia. The leads are patterned in mirror image fashion to a plurality ofterminals on one side of the power chip. In one form, a further sheet metal lead is attached to a further dielectric substrate and is adapted to abut a terminal on the other side of the power chip. In another form, heat transfer structure is provided for transferring heat between the pair of dielectric substrates, thereby enabling heat to be removed from both sides of the power chip.</p> |
