METHOD FOR DETERMINING CONCENTRATION OF ORGANIC ADDITIVE IN COPPER ELECTROPLATING BATH

摘要

The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an electrolytic copper plating bath, passing an electric current from the anode to the cathode and reference electrode; measuring the voltage difference between the cathode and reference electrode; and comparing the difference to values for known concentrations of the organic additive.