| 摘要 |
PURPOSE:To facilitate exposure of the resist film formed on main and back surface of end portion of a wafer without using a mask by providing a light source for exposure which radiates light flux locally, on the main and the back surfaces of end portion of the wafer. CONSTITUTION:A wafer 2 on wihch a resist film is formed is fixed near a turntable 1. An exposing part 5 is also formed near the turntable 1. The exposing part 5 is provided with a light-flux supplying pipe 8a which supplies a light flux having a predetermined wave length from a light source 8 for exposure to the end portion of back surface of the wafer 2 locally. A reflecting mirror 10 is provided at the front end of the supplying pipe 8a. This mirror 10 is arranged so as to reflect the light flux emitted from the supplying pipe 8a and to supply it to the circumferential side plane of the wafer 2. In this resist exposing device 20 thus constituted, the wafer 2 on which the resist film 21 is formed is set on the exposing part 5 and is irradiated with the light flux from the supplying pipe 8a while being rotated, thereby facilitating exposure of the circumferential end portion of back surface of the wafer 2. |
