| 发明名称 |
Process of plating on anodized aluminium substrates. |
| 摘要 |
<p>A method for preparing aluminium substrates for plating Nickel and copper thereon. This method includes sensitizing the surface of the substrates in a solution of sncl2 and HCL and activating said surface in a solution containing Pdcl2 and HCL.</p> |
| 申请公布号 |
EP0114943(A1) |
申请公布日期 |
1984.08.08 |
| 申请号 |
EP19830110672 |
申请日期 |
1983.10.26 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BURNS, RICHARD WAYNE;MAHMOUD, ISSA SAID |
| 分类号 |
C23C18/18;C25D5/44;C25D11/18;C25D11/24;H05K1/05;H05K3/18;(IPC1-7):23C3/00 |
主分类号 |
C23C18/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
