发明名称 CONTINUOUS HOT DIPPING METHOD
摘要 PURPOSE:To apply continuous thick plating with good appearance by quenching a material to be plated without generating an oxide film, by a method wherein a draining apparatus comprising a double pipe is immersed in a plating bath and a cooling medium is sprayed to the periphery of the material to be plated from many directions while forming an eddy current to said cooling medium. CONSTITUTION:A draining apparatus 4 is formed of an inner and an outer double tubular members 5, 6 and the lower part thereof is immersed in a plating bath 2. A cooling medium 10 comprising non-oxidative low temp. gas, liquid or a mixture thereof sent into an eddy current chamber between the tubular members 5, 6 from an introducing port 9 receives rotation in the peripheral direction of a material 1 to be plated to form an eddy current apparatus. A cooling medium 10 to which rotary motion is imparted is sprayed to the periphery of the material 1 to be plated in an almost uniform flow amount from outflow ports 8 in two directions or more and discharged from the upper part. The material 1 to be plated is uniformly quenched from the periphery thereof by the eddy current of the cooling medium and, at the same time, the drawing-up part of the plating bath 2 is prevented from oxidation because held under a non- oxidative atmosphere.
申请公布号 JPS59136466(A) 申请公布日期 1984.08.06
申请号 JP19830011019 申请日期 1983.01.25
申请人 SUMITOMO DENKI KOGYO KK 发明人 SATOU KENICHI;TAKANO SATORU;MIYAZAKI TAKESHI
分类号 C23C2/26;C23C2/28;C23C2/36;C23C2/38 主分类号 C23C2/26
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