| 摘要 |
PURPOSE:To omit a bonding between a lead and an electrode, and to obtain an improvement in adhesive strength and a protection of a junction section simultaneously by forming one electrode of a semiconductor element of mesa type structure so as to extend in a beltlike shape toward the outside of a semiconductor substrate and using the beltlike section as the lead. CONSTITUTION:An electrode 13 takes a shape combining an electrode and a lead. The electrode 13 may take a shape extending only to one side as required, or may take a shape that six leads called a hexa-lead are extended to an external form. The shape of a package takes various shapes as necessary. When the electrode is incorporated into the package, the lead and the element electrode need not be compression-bonded. When it is incorporated through thermocompression bonding, only a connection to an electrode 14 may be made appropriate in load, an element is not deteriorated, and adhesive strength can be obtained sufficiently. |
