| 摘要 |
PURPOSE:To form a semiconductor device uniformly and thin without needing to control the thickness thereof by a method wherein an electrical insulating layer to cover a heat radiating plate on a lead frame is removed and the lead frame is integrally molded into one body with an electrical insulating member. CONSTITUTION:An electrical insulating layer 13 is coated on the heat radiating surface 12a of a heat radiating plate 12. The heat radiating surface 12a is on a plane protruding more than other part of a lead frame to the heat radiating plate on the molded lead frame. After then, when the lead frame is formed on a semiconductor device by performing a filling up of moled resin after the mounting was performed, the heat radiating surface side of the heat radiating plate is tightly adhered to the inner surface of a cavity opposing to the surface side thereof for preventing from being coated with molded resin. |
