发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the yield of broken parts of a package when resin burr and the like are cut and removed, by forming the boundary between the side surface of the package and leads, which is located on one main surface side of the leads, outside of the boundary position on the other surface side of the leads. CONSTITUTION:Leads 4 are sealed with an epoxy resin of a package main body 1. A tab 5 is formed at the central part of the leads 4. A pellet 3 is attached on the tab 5 with paste 6, and an island part 8 is formed. A bonding pad 3a on the pellet 3 and an inner lead part 4a are electrically connected with a wire 7. The package main body 2 has a shape, in which an upper half package body 11 and a lower half package body 12 having a trapezoidal cross section are contacted at their bottom surfaces. The bottom part B of the lower half package body 12 is smaller than the bottom part A of the upper half package body 11. Then, the broken parts in the package are not yielded in the resin-burr cutting and removing process.
申请公布号 JPS6269536(A) 申请公布日期 1987.03.30
申请号 JP19850208655 申请日期 1985.09.24
申请人 HITACHI LTD 发明人 TABATA KATSUHIRO;TSUKUDA SHIGERU
分类号 H01L23/28;H01L23/31 主分类号 H01L23/28
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