发明名称 CERAMIC PACKAGE FOR HIGH-DENSITY MOUNTING
摘要 PURPOSE:To increase the number of leads by two times by a method wherein leads are arranged in such a manner that leads on the top-surface side are longer ones and leads on the under-surface side are shorter ones and the leads on the under-surface side are set between the leads on the top-surface side. CONSTITUTION:Leads consist of leads 207 on the top surface and leads 208 on the under surface and the leads are arranged in such a manner that the leads 208 on the under surface are set between the leads 207 on the top surface. Through these procedures, the number of leads is increased by two times. Moreover, for preventing it for the upper and lower leads to contact to each other, both of the leads 207 and the leads 208 are bent beneath in such a manner that the leads 207 are placed on the outside and the leads 208 are placed on the inside, and furthermore soldered parts at the upper and lower surfaces are arranged alternately. As a result, a ceramic package can be increased the number of leads by two times without enlarging the dimension of the main body thereof and without changing the pitch thereof.
申请公布号 JPS59135754(A) 申请公布日期 1984.08.04
申请号 JP19830010062 申请日期 1983.01.24
申请人 SUWA SEIKOSHA KK 发明人 GOTOU MAKIO
分类号 H01L23/12;H01L23/498;H01L23/50;H05K3/30 主分类号 H01L23/12
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