发明名称 SEMICONDUCTOR CHIP ASSEMBLED BODY
摘要 PURPOSE:To perform the continuous stable supply of chips by a method wherein a semiconductor chip is placed in the recess of a band form continuous strip material having a plurality of recesses, apertures are covered with the band form continuous strip material, thus sealing reducing gas in the recesses, and mechanical feeding holes are provided in the continuous strip material. CONSTITUTION:The holes 1a for containing chips 3 are arranged in a tape 1 at equal intervals, tapes 2 and 2a are fixed with an adhesive material 6 by sandwiching the tape 1 on both sides so as to cover the hole 1a, and the reducing gas 5 is introduced to the hole 1a. The chip 3 is contained to the holes 1a by one. The feeding holes 4 corresponding to loading the chips 3 are provided in the tapes 1, 2 and 2a. This constitution makes a containing area small by rolling up the tape and enables to securely carry the chips 3 by utilizing the feeding holes 4. When the tape 2 or 2a is stripped off from the tape 1, one of the chips can be securely taken out and then can be supplied continuously and stably, and besides there is no possibility of oxidation.
申请公布号 JPS59134818(A) 申请公布日期 1984.08.02
申请号 JP19830008453 申请日期 1983.01.20
申请人 MATSUSHITA DENKI SANGYO KK 发明人 TANAKA KURAHEI;MORI KAZUHIRO;ICHITENMANYA EIJI;HATA KANJI
分类号 H01L21/673;H01L21/02 主分类号 H01L21/673
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