METHOD OF MOUNTING AT LEAST ONE ELECTRONIC COMPONENT

摘要

A method of mounting electronic components on a printed circuit board by temporarily attaching the electronic component (4) to the circuit board (1) with adhesive (3) applied to the board (1), irradiating the adhesive (3) with ultraviolet rays with or without heating to cure the adhesive (3) and thereby rigidly attach the component (4) to the board (1), and thereafter joining the electrodes (5) of the component (4) to conductor portions (2) on the board (1). Excess adhesive portions (3a) adjoining the component (4) are cured first to subsequently cure the other portion of the adhesive (3) in chain relation to the curing of the excess.