Heat exchanger for an electronics cabinet

摘要

The invention relates to an air-air heat exchanger for an electronics cabinet, having a folded-surface profile (3) by means of which a separate flow path can be achieved for the inner air of the electronics cabinet and the cooling outer air, and, as a result of which, in a dust-proof electronics cabinet, dissipation of the heat produced in the electronics cabinet is achieved. For simple production of the folded-surface profile (3), said profile is manufactured from folded laminates (6) which have a U-shaped cross-section with laterally projecting flanges (6c, 6d) on each limb end. One of the flanges (6c, 6d) of each folded laminate (6) is provided with perforations (6g). The folded laminates (6) are arranged side-by-side on a covering plate (5) so that the flanges (6c) which are provided with perforations (6g) rest on the covering plate (5) and are covered by a flange (6d) of an adjacent folded laminate (6). The folded laminates (6) are jointly bonded to the covering plate (5) by means of an adhesive (7) which is inserted at least into the perforations (6g). <IMAGE>