| 摘要 |
PURPOSE:To efficiently remove clogging by pulverizing the accumulated article of a polishing pad by applying ultrasonic-wave vibration and adsorbing and removing the pulverized articles, in an apparatus for removing the clogging in a polishing apparatus for semiconductor wafers, etc. CONSTITUTION:The captioned apparatus is constituted of an ultrasonic-wave vibration source 6, contactor 8 which is equipped with a vibrator which constitutes an ultrasonic-wave vibration mechanism together with the vibration srouce 6 and has an absorption hole 7, separator 10 connected to the absorption hole 7 through conduit 9, and a vacuum pump 11 connected to the separator 10. When the foreign materials accumulated between the cilium of the polishing pad sticked onto a surface plate which is revolution-driven is removed, the contactor 8 is loaded onto the pad 13, and the ultrasonic-wave vibrator 6 is operated to beat the pad 13, and the foreign material is pulverized. Then, the foreign material pulverized is absorbed from an absorption port 7, by the operation of a vacuum pump 11 and accumulated into the separator 10 through the conduit 9. |
