| 摘要 |
<p>PURPOSE:To remove the adverse influence of a malfunction part to the productivity by inspecting the electric characteristics in on-line system during the step of bonding lead wirings to the surface of a semiconductor chip and removing the malfunction part. CONSTITUTION:A semiconductor chip 10 is mounted on a leadframe 13, lead wirings 7 are supplied from a fine tube 6, and bonded by supersonic thermal press-bonding to the electrodes on the suface of the chip. A voltage 8 is applied through a switch 9 to the wirings 7 to measure or indicate it on M. As a result, the damage of the chip, the improper fixture and improper bonding can be readily detected. The chip can be replaced by a good chip as required. Subsequently, the wirings 7 are bonded to an anode connector 14, the switch 9 is similarly closed to inspect. According to this structure, only good chips can be supplied to the later steps, thereby improving the productivity and reducing the cost.</p> |
