发明名称 SOLDERING DEVICE
摘要 PURPOSE:To obtain sure soldering by providing an oscillation generator and oscillating a printed wiring board under immersion in molten solder. CONSTITUTION:A printed wiring board 6 mounted thereon with electronic parts 8, 8' is detained with pawls 12, and is carried to a coater, by which a flux is coated thereon. The board is thereafter heated with a heater to raise stepwise the temp. of the parts 8, 8'. Molten solder 11 is ejected by a motor 13 provided in a tank 4 in which the solder 11 is stored to stick the solder to the board 6. Oscillation generators 14a and 14b provided in the position where the wiring board contacts with the pawls 12 are operated to oscillate the board 6 in the direction perpendicular to the conveyance direction. The foam 10 generated in the soldered positions of the board 6 is moved by the oscillation of the board 6 without stagnating at one place and the wiring board is accurately soldered without any defect in soldering.
申请公布号 JPS59133971(A) 申请公布日期 1984.08.01
申请号 JP19830008402 申请日期 1983.01.20
申请人 MATSUSHITA DENKI SANGYO KK 发明人 OKADA YOSHIFUMI;HANAMOTO SHIGEYUKI;ASADA YASUHIRO
分类号 H05K3/34;B23K1/06;B23K1/08;B23K3/06 主分类号 H05K3/34
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